Integra Technologies INC.
Integra Wafer & Die Products processes semiconductor wafers and dies, offering services including wafer thinning, polishing, and dicing; die inspection and attachment; encapsulation; flip chip and interconnect processing; and electrical testing including wafer probe and singulated die probe. The company serves the semiconductor and microelectronics industries with capabilities in standard IC packaging, system-in-package (SiP), and multichip module (MCM) assembly, along with reliability and qualification services such as plastic encapsulated microcircuit qualification and ESD services.
Supplier designations
Self-certified by the company in its SAM.gov registration
Their plant
| Facility | City | State | Employees | Status |
|---|---|---|---|---|
| Integra Technologies INC. | Wichita | KS | — | ACTIVE |
Compiled from federal records — EPA, OSHA, SAM.gov and the U.S. Census — and from the company’s own website. Federal source data is public domain. Each plant’s page names the source of every field.