Hybond, INC.
330 State Pl, Escondido, CA 92029
Operating signal within 12 months from two or more independent sources.
What they make
Semiconductor Machinery Manufacturing333242HYBOND, Inc. manufactures semiconductor bonding equipment, including wire bonders, peg and beam bonders, and die bonders. The company's products use thermosonic, ultrasonic, epoxy, and eutectic bonding processes, and include models such as the 626 Multipurpose Digital Thermosonic Bonder, 676 Digital Wedge Bonder, and EDB-140B Epoxy Die Bonder.
SUMMARIZED FROM THE COMPANY’S OWN WEBSITE
Where it is
Other plants nearby
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|---|---|---|---|---|
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Also at this address
No other federal record shares this street address.
WHERE THIS RECORD COMES FROM — 2 FEDERAL SOURCES, 8 FIELDS
Every fact on this page traces to a public federal filing. The table below names which register holds this facility, whether that register proves the plant operates or only that it exists, and when each of them last saw it.
| Source | Evidence | First seen | Last seen |
|---|---|---|---|
| COMPANY SITE | OPERATING | JUL 2026 | AUG 2026 |
| SAM GOV | OPERATING | MAY 2026 | MAY 2026 |
FIELD BY FIELD — WHICH SOURCE SUPPLIED WHAT
| FIELD | SOURCE | SIGNAL |
|---|---|---|
| ADDRESS LINE1 | SAM GOV | MAY 2026 |
| CAGE CODE | SAM GOV | MAY 2026 |
| CITY | SAM GOV | MAY 2026 |
| GEOM | CENSUS GEOCODER | JUL 2026 |
| NAME | SAM GOV | MAY 2026 |
| REGISTRATION EXPIRATION | SAM GOV | MAY 2026 |
| STATE | SAM GOV | MAY 2026 |
| WEBSITE | SAM GOV | MAY 2026 |
Status is computed from independent sources; nothing here is self-reported unless marked Claimed.


