Mosaic Microsystems LLC

What they make

Mosaic Microsystems is a microelectronics and photonics packaging company that specializes in thin glass substrates and solutions. The company uses a proprietary bonding process called VIAFFIRM to enable thin glass (≤200 micrometers thickness) for packaging applications, and offers products including handle wafer thin glass, thin glass with custom through-glass vias, thin glass with filled or planar vias, and metallized thin glass wafers.

SUMMARIZED FROM THE COMPANY’S OWN WEBSITE

Where it is

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